Cooling Material Thermal Pad Silicone Gap Pad For Electronic Products

Cooling Material Thermal Pad Silicone Gap Pad For Electronic  Products

Model No.︰PM460

Brand Name︰Karefonte

Country of Origin︰China

Unit Price︰-

Minimum Order︰2 pc

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Product Description

Specifications

1.High thermal conductivity 
2.Low thermal resistance 
3.Stable performance 
4.its viscosity high 
5.Low hardness 

Applications:

1. Car engine module and vehicle electronic equipment

2. Notebook computer, table computer CPU

3. Flat panel TV, mobile equipment, high-speed hard disk driver

4. Semiconductor and the radiating fin between

5. Computer, PC server, workstation

6. LED lighting device and mass storage device

Performance and characteristics:

1.High thermal conductivity, heat transfer coefficient 4.6W/m-k

2.Stable performance , low thermal resistance, effectively improve the heat transfer speed

3.Low hardness , its viscosity high, easy to use adhesive 4.By UL and V-O certification standards. 

Specification:

Product standard size 330mm*330mm, 200mm*400mm according to customer needs cutting type Basic thickness 0.25mm*5.0mm, special size and thickness can be customized The product itself is slightly viscous, if need to strengthen the adhesive can be according to customer’ requirement. Product color is mass production, if need special color can be adjusted according to the actual situation

Price Terms︰ FOB / CIF

Payment Terms︰ TT/ Western Union / Paypal / MoneyGram

Packing︰ box

Lead Time︰ after payment 1-3 working days

Standards Certificate︰ ISO9001, RoHS, REACH

Color︰ hoar / black / blue

Size︰ 200 mm x 400 mm (can customized))

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